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Exact MPN15 sourced attributes2 source documents

AMD Xilinx · exact orderable part

XCZU3EG-2SFVC784I

IC SOC CORTEX-A53 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Number of I/O: 252
Operating Temperature: -40°C~100°C(TJ)
Peripherals: DMA, WDT

Original manufacturerCommercial terms confirmed per lot

ManufacturerAMD Xilinx

Package / case784-BFBGA, FCBGA

PackingTray

Technical parameters

Technical specifications

15 normalized values · 2 validated sources

XCZU3EG-2SFVC784I technical parameters
Parameter	Value
Architecture	MCU, FPGA [2]
Base Product Number	XCZU3 [2]
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG [2]
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 [2]
Mfr	AMD Xilinx [2]
Number of I/O	252 [2]
Operating Temperature	-40°C~100°C(TJ) [2]
Peripherals	DMA, WDT [2]
Primary Attributes	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells [2]
RoHS (DigiKey record)	ROHS3 Compliant [2]
Product Status	Active [2]
RAM Size	256KB [2]
Series	Zynq® UltraScale+™ MPSoC EG [2]
Speed	533MHz, 600MHz, 1.3GHz [2]
Package / Case	784-BFBGA, FCBGA [2]

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