Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Number of channels | 8 [2] |
| Topology | Open drain [2] |
| Vin (min) (V) | 4.5 [2] |
| Vin (max) (V) | 5.5 [2] |
| Vout (max) (V) | 50 [2] |
| Features | Thermal shutdown [2] |
| Operating temperature range (°C) | -40 to 125 [1] |
| Exact package type | SOIC (DW) [2] |
| Exact package pins | 20 [2] |
| Exact package footprint area (mm²) | 131.84 [2] |
| Exact package length (mm) | 12.8 mm [2] |
| Exact package width (mm) | 10.3 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Moisture sensitivity level | Level-1 [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Part-details package type | SOIC (DW) [1] |
| Part-details package pins | 20 [1] |
| Package quantity | 2000 [1] |
| Package carrier | LARGE T&R [1] |