Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Bits (#) | 8 [2] |
| Data rate (max) (Mbps) | 200 [2] |
| Topology | Push-Pull [2] |
| Vin (min) (V) | 4.5 [2] |
| Vin (max) (V) | 5.5 [2] |
| Vout (min) (V) | 2.7 [2] |
| Vout (max) (V) | 5.5 [2] |
| Applications | GPIO, JTAG, SPI, UART [2] |
| Features | Output enable [2] |
| Prop delay (ns) | 6.7 [2] |
| Technology family | LVC [2] |
| Supply current (max) (mA) | 0.13 [2] |
| Operating temperature range (°C) | -40 to 85 [1] |
| Exact package type | SOIC (DW) [2] |
| Exact package pins | 24 [2] |
| Exact package footprint area (mm²) | 159.65 [2] |
| Exact package length (mm) | 15.5 mm [2] |
| Exact package width (mm) | 10.3 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Moisture sensitivity level | Level-1 [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Lead finish | NiPdAu [1] |
| Part-details package type | SOIC (DW) [1] |
| Ball material | Sn [1] |
| Part-details package pins | 24 [1] |
| Package quantity | 2000 [1] |
| Package carrier | LARGE T&R [1] |