Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Technology family | LVC [2] |
| Number of channels | 8 [2] |
| IOL (max) (mA) | 24 [2] |
| Supply current (max) (µA) | 40 [2] |
| IOH (max) (mA) | -24 [2] |
| Input type | Standard CMOS [2] |
| Output type | 3-State [2] |
| Features | Balanced outputs, Very high speed (tpd 5-10ns) [2] |
| Operating temperature range (°C) | -40 to 125 [1] |
| Exact package type | TSSOP (PW) [2] |
| Exact package pins | 20 [2] |
| Exact package footprint area (mm²) | 41.6 [2] |
| Exact package length (mm) | 6.5 mm [2] |
| Exact package width (mm) | 6.4 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Moisture sensitivity level | Level-1 [1] |
| Lead finish | NiPdAu [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Ball material | Sn [1] |
| Part-details package type | TSSOP (PW) [1] |
| Part-details package pins | 20 [1] |
| Package quantity | 2000 [1] |
| Package carrier | LARGE T&R [1] |