Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Technology family | HC [2] |
| Number of channels | 4 [2] |
| IOL (max) (mA) | 5.2 [2] |
| IOH (max) (mA) | -5.2 [2] |
| Input type | Standard CMOS [2] |
| Output type | Push-Pull [2] |
| Features | High speed (tpd 10-50ns) [2] |
| Data rate (max) (Mbps) | 28 [2] |
| Operating temperature range (°C) | -40 to 85 [1] |
| Exact package type | SOIC (D) [2] |
| Exact package pins | 14 [2] |
| Exact package footprint area (mm²) | 51.9 [2] |
| Exact package length (mm) | 8.65 mm [2] |
| Exact package width (mm) | 6 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Lead finish | NiPdAu [1] |
| Ball material | Sn [1] |
| Moisture sensitivity level | Level-1 [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Part-details package type | SOIC (D) [1] |
| Part-details package pins | 14 [1] |
| Package quantity | 2500 [1] |
| Package carrier | LARGE T&R [1] |