Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Base Product Number | NC191 [1] |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) [1] |
| Flux Type | No-Clean [1] |
| Form | Jar, 1.76 oz (50g) [1] |
| Mfr | Chip Quik Inc. [1] |
| Melting Point | 422 ~ 428°F (217 ~ 220°C) [1] |
| Product Status | Active [1] |
| Mesh Type | 4 [1] |
| Type | Solder Paste [1] |
| Process | Lead Free [1] |
| Series | Smooth Flow™ [1] |
| Shelf Life | 6 Months [1] |
| Shelf Life Start | Date of Manufacture [1] |
| Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) [1] |
Specification references[1]Chip Quik Inc. NC191SNL50 vendor product record ↗