Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Vin (max) (V) | 30 [2] |
| Vin (min) (V) | 2 [2] |
| Vout (max) (V) | 29 [2] |
| Vout (min) (V) | 1.2 [2] |
| Iq (typ) (mA) | 0.075 [2] |
| Features | Enable, Power good [2] |
| Operating temperature range (°C) | -40 to 125 [1] |
| Exact package type | SOIC (D) [2] |
| Exact package pins | 8 [2] |
| Exact package footprint area (mm²) | 29.4 [2] |
| Exact package length (mm) | 4.9 mm [2] |
| Exact package width (mm) | 6 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Moisture sensitivity level | Level-1 [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Part-details package type | SOIC (D) [1] |
| Part-details package pins | 8 [1] |
| Package quantity | 2500 [1] |
| Package carrier | LARGE T&R [1] |