Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Number of channels | 2 [2] |
| Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) | 26 [2] |
| Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) | 3 [2] |
| Rail-to-rail | In to V- [2] |
| GBW (typ) (MHz) | 0.7 [2] |
| Slew rate (typ) (V/µs) | 0.3 [2] |
| Vos (offset voltage at 25°C) (max) (mV) | 7 [2] |
| Iq per channel (typ) (mA) | 0.35 [2] |
| Vn at 1 kHz (typ) (nV√Hz) | 40 [2] |
| Operating temperature range (°C) | -40 to 125 [1] |
| Offset drift (typ) (µV/°C) | 7 [2] |
| Features | Cost Optimized [2] |
| Input bias current (max) (pA) | 250000 [2] |
| CMRR (typ) (dB) | 80 [2] |
| Iout (typ) (A) | 0.03 [2] |
| Architecture | Bipolar [2] |
| Input common mode headroom (to negative supply) (typ) (V) | 0 [2] |
| Input common mode headroom (to positive supply) (typ) (V) | -1.5 [2] |
| Moisture Sensitivity Level | Level-1 [1] |
| Output swing headroom (to negative supply) (typ) (V) | 0.005 [2] |
| Output swing headroom (to positive supply) (typ) (V) | -2 [2] |
| Exact package type | SOIC (D) [2] |
| Exact package pins | 8 [2] |
| Exact package footprint area (mm²) | 29.4 [2] |
| Exact package length (mm) | 4.9 mm [2] |
| Exact package width (mm) | 6 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Part-details package type | SOIC (D) [1] |
| Part-details package pins | 8 [1] |
| Package quantity | 2500 [1] |
| Package carrier | LARGE T&R [1] |