Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Contact Finish - Mating | Tin [1] |
| Base Product Number | ICF-628 [1] |
| Contact Finish - Post | Tin [1] |
| Contact Material - Mating | Beryllium Copper [1] |
| Contact Material - Post | Beryllium Copper [1] |
| Contact Resistance | 10mOhm [1] |
| Features | Open Frame [1] |
| Housing Material | Liquid Crystal Polymer (LCP) [1] |
| Mfr | Samtec Inc. [1] |
| Mounting Type | Surface Mount [1] |
| Number of Positions or Pins (Grid) | 28 (2 x 14) [1] |
| Operating Temperature | -55°C~125°C [1] |
| Pitch - Mating | 0.100" (2.54mm) [1] |
| Pitch - Post | 0.100" (2.54mm) [1] |
| Product Status | Active [1] |
| Series | iCF [1] |
| Termination | Solder [1] |
| Type | DIP, 0.6" (15.24mm) Row Spacing [1] |
Specification references[1]Samtec Inc. ICF-628-T-O-TR vendor product record ↗
