ICF-308-S-O representative package visual — not an exact-product photograph
Representative package visual — not an exact-product photographProduct referenceVendor-delivered DigiKey product/package image
Exact MPN18 sourced attributes1 source document

Samtec Inc. · exact orderable part

ICF-308-S-O

CONN IC DIP SOCKET 8POS TIN

Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Pitch - Post
0.100" (2.54mm)
Mounting Type
Surface Mount
Termination
Solder
Contact Finish - Mating
Gold
Contact Finish - Post
Tin
Contact Material - Mating
Beryllium Copper
Original manufacturerCommercial terms confirmed per lot
ManufacturerSamtec Inc.
Mounting typeSurface Mount
PackingTube

Technical parameters

Technical specifications

ICF-308-S-O technical parameters
ParameterValue
Contact Finish - MatingGold [1]
Base Product NumberICF-308 [1]
Contact Finish - PostTin [1]
Contact Finish Thickness - Mating30.0µin (0.76µm) [1]
Contact Material - MatingBeryllium Copper [1]
Contact Material - PostBeryllium Copper [1]
FeaturesOpen Frame [1]
Housing MaterialLiquid Crystal Polymer (LCP) [1]
MfrSamtec Inc. [1]
Mounting TypeSurface Mount [1]
Number of Positions or Pins (Grid)8 (2 x 4) [1]
Operating Temperature-55°C ~ 125°C [1]
Pitch - Mating0.100" (2.54mm) [1]
Pitch - Post0.100" (2.54mm) [1]
Product StatusActive [1]
SeriesICF [1]
TerminationSolder [1]
TypeDIP, 0.3" (7.62mm) Row Spacing [1]

Catalog relationships

Keep family and exact MPN intent separate.

This page describes one orderable part. A family page helps select suffixes but never carries assumed stock or a price.

Related exact parts

Other published parts

Browse exact MPNs and compare their specifications. These links do not imply compatibility or interchangeability.