Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Contact Finish - Mating | Gold [1] |
| Base Product Number | IC-628 [1] |
| Contact Finish - Post | Gold [1] |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) [1] |
| Contact Material - Mating | Beryllium Copper [1] |
| Contact Material - Post | Phosphor Bronze [1] |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) [1] |
| Contact Resistance | 10mOhm [1] |
| Current Rating (Amps) | 1 A [1] |
| Features | Open Frame [1] |
| Housing Material | Polyester, Glass Filled [1] |
| Material Flammability Rating | UL94 V-0 [1] |
| Mfr | Samtec Inc. [1] |
| Mounting Type | Through Hole [1] |
| Number of Positions or Pins (Grid) | 28 (2 x 14) [1] |
| Operating Temperature | -55°C ~ 125°C [1] |
| Pitch - Mating | 0.100" (2.54mm) [1] |
| Pitch - Post | 0.100" (2.54mm) [1] |
| Product Status | Active [1] |
| Series | IC [1] |
| Termination | Solder [1] |
| Termination Post Length | 0.125" (3.18mm) [1] |
| Type | DIP, 0.6" (15.24mm) Row Spacing [1] |
Specification references[1]Samtec Inc. IC-628-SGG vendor product record ↗