Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Base Product Number | CQ100G [1] |
| Composition | Sn99.244Cu0.7 (Ni0.05/Ge0.006) [1] |
| Flux Type | No-Clean [1] |
| Form | Syringe, 1.23 oz (35g), 10cc [1] |
| Mfr | Chip Quik Inc. [1] |
| Melting Point | 441°F (227°C) [1] |
| Product Status | Active [1] |
| Mesh Type | 4 [1] |
| Type | Solder Paste [1] |
| Process | Lead Free [1] |
| Shelf Life | 6 Months [1] |
| Shelf Life Start | Date of Manufacture [1] |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) [1] |
Specification references[1]Chip Quik Inc. CQ100GE 35G vendor product record ↗