Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Configuration | 4:1 [2] |
| Number of channels | 2 [2] |
| Power supply voltage - single (V) | 3.3, 5, 12, 16, 20 [2] |
| Power supply voltage - dual (V) | +/-10, +/-2.5, +/-5 [2] |
| Protocols | Analog [2] |
| Ron (typ) (Ω) | 125 [2] |
| CON (typ) (pF) | 18 [2] |
| ON-state leakage current (max) (µA) | 0.3 [2] |
| Supply current (typ) (µA) | 0.04 [2] |
| Bandwidth (MHz) | 25 [2] |
| Operating temperature range (°C) | -55 to 125 [1] |
| Features | Break-before-make [2] |
| Input/output continuous current (max) (A) | 0.01 [2] |
| Drain supply voltage (max) (V) | 20 [2] |
| Negative rail supply voltage (max) (V) | 0 [2] |
| Exact package type | SOIC (D) [2] |
| Exact package pins | 16 [2] |
| Exact package footprint area (mm²) | 59.4 [2] |
| Exact package length (mm) | 9.9 mm [2] |
| Exact package width (mm) | 6 [2] |
| RoHS | Yes [1] |
| REACH | Yes [1] |
| Moisture sensitivity level | Level-1 [1] |
| Peak reflow temperature (°C) | 260 [1] |
| Part-details package type | SOIC (D) [1] |
| Part-details package pins | 16 [1] |
| Package quantity | 2500 [1] |
| Package carrier | LARGE T&R [1] |