Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Product rating | Catalog [2] |
| RoHS | Yes [2] |
| REACH | Yes [2] |
| Lead finish | NiPdAu [2] |
| Ball material | NiPdAuAg [2] |
| Moisture sensitivity level | 3 [2] |
| Peak reflow temperature | 260 °C [2] |
| MSL floor life | 168 HR [2] |
| Package | VQFN (RHA) [2] |
| Pin count | 40 pins [2] |
| Operating temperature minimum | -40 °C [2] |
| Operating temperature maximum | 85 °C [2] |
| Package quantity | 2500 units [2] |
| Carrier | LARGE T&R [2] |
| CPU | 8051 [1] |
| Technology | 2.4 GHz, Bluetooth® LE [1] |
| Protocols | Bluetooth® Low Energy [1] |
| Flash memory | 256 kByte [1] |
| RAM | 8 kByte [1] |
| Peripherals | 12-bit ADC 8-channel, 2 SPI, 2 UART, 4 timers, I2C [1] |
| Number of GPIOs | 23 [1] |
| Security | Cryptographic acceleration, Device attestation & anti-counterfeit, Secure debug, Software IP protection [1] |
| Operating system | TI RTOS [1] |
| Type | Wireless MCU [1] |
| Sensitivity (best) | -94 dBm [1] |
| Edge AI enabled | No [1] |
