Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Capacitance | 1 µF [1] |
| Applications | Bypass, Decoupling [1] |
| Tolerance | ±20% [1] |
| Features | Low ESL (Reverse Geometry) [1] |
| Product Status | Obsolete [1] |
| Mfr | TDK Corporation [1] |
| Mounting Type | Surface Mount, MLCC [1] |
| Operating Temperature | -55°C~125°C [1] |
| Series | C [1] |
| Size / Dimension | 0.063" L x 0.126" W (1.60mm x 3.20mm) [1] |
| Package / Case | 0612 (1632 Metric) [1] |
| Temperature Coefficient | X7R [1] |
| Thickness (Max) | 0.051" (1.30mm) [1] |
| Voltage - Rated | 16V [1] |
Specification references[1]TDK Corporation C1632X7R1C105M115AC vendor product record ↗
