Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) [1] |
| Flux Type | No-Clean [1] |
| Mfr | Harimatec Inc. [1] |
| Melting Point | 423°F (217°C) [1] |
| Product Status | Obsolete [1] |
| Type | Solder Paste [1] |
| Process | Lead Free [1] |
| Series | LOCTITE® GC 18 [1] |
| Shelf Life | 6 Months [1] |
| Shelf Life Start | Date of Manufacture [1] |
| Storage/Refrigeration Temperature | 41°F~77°F(5°C~25°C) [1] |
Specification references[1]Harimatec Inc. 2472658 vendor product record ↗
