Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Base Product Number | 24-5050 [2] |
| Composition | Sn50Pb50 (50/50) [2] |
| Flux Type | Rosin Activated (RA) [2] |
| Diameter | 0.125" (3.18mm) [2] |
| Form | Spool, 1 lb (454 g) [2] |
| Mfr | Kester Solder [2] |
| Melting Point | 361 ~ 420°F (183 ~ 216°C) [2] |
| Product Status | Active [2] |
| Type | Wire Solder [2] |
| Process | Leaded [2] |
| Series | 44 [2] |
| Wire Gauge | 8 AWG, 10 SWG [2] |
| Storage/Refrigeration Temperature | 50°F~104°F(10°C~40°C) [2] |
Specification references[1]24-5050-0068 delivered document ↗[2]Kester Solder 24-5050-0068 vendor product record ↗