Technical parameters
Technical specifications
| Parameter | Value |
|---|---|
| Contact Finish - Mating | Gold [2] |
| Base Product Number | 641605 [2] |
| Contact Finish - Post | Gold [2] |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) [2] |
| Contact Material - Mating | Beryllium Copper [2] |
| Contact Material - Post | Beryllium Copper [2] |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) [2] |
| Contact Resistance | 30mOhm [2] |
| Features | Open Frame [2] |
| Housing Material | Thermoplastic, Glass Filled [2] |
| Material Flammability Rating | UL94 V-0 [2] |
| Mfr | TE Connectivity AMP Connectors [2] |
| Mounting Type | Through Hole [2] |
| Number of Positions or Pins (Grid) | 28 (2 x 14) [2] |
| Operating Temperature | -55°C ~ 125°C [2] |
| Pitch - Mating | 0.100" (2.54mm) [2] |
| Pitch - Post | 0.100" (2.54mm) [2] |
| Product Status | Obsolete [2] |
| Series | Diplomate DL [2] |
| Termination | Solder [2] |
| Termination Post Length | 0.128" (3.24mm) [2] |
| Type | DIP, 0.6" (15.24mm) Row Spacing [2] |
