2-641605-2 representative package visual — not an exact-product photograph
Representative package visual — not an exact-product photographProduct referenceVendor-delivered DigiKey product/package image
Exact MPN22 sourced attributes2 source documents

TE Connectivity AMP Connectors · exact orderable part

2-641605-2

CONN IC DIP SOCKET 28POS GOLD

Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Pitch - Post
0.100" (2.54mm)
Mounting Type
Through Hole
Termination
Solder
Contact Resistance
30mOhm
Contact Finish - Mating
Gold
Contact Finish - Post
Gold
Original manufacturerCommercial terms confirmed per lot
ManufacturerTE Connectivity AMP Connectors
Mounting typeThrough Hole
PackingTube

Technical parameters

Technical specifications

2-641605-2 technical parameters
ParameterValue
Contact Finish - MatingGold [2]
Base Product Number641605 [2]
Contact Finish - PostGold [2]
Contact Finish Thickness - Mating30.0µin (0.76µm) [2]
Contact Material - MatingBeryllium Copper [2]
Contact Material - PostBeryllium Copper [2]
Contact Finish Thickness - Post30.0µin (0.76µm) [2]
Contact Resistance30mOhm [2]
FeaturesOpen Frame [2]
Housing MaterialThermoplastic, Glass Filled [2]
Material Flammability RatingUL94 V-0 [2]
MfrTE Connectivity AMP Connectors [2]
Mounting TypeThrough Hole [2]
Number of Positions or Pins (Grid)28 (2 x 14) [2]
Operating Temperature-55°C ~ 125°C [2]
Pitch - Mating0.100" (2.54mm) [2]
Pitch - Post0.100" (2.54mm) [2]
Product StatusObsolete [2]
SeriesDiplomate DL [2]
TerminationSolder [2]
Termination Post Length0.128" (3.24mm) [2]
TypeDIP, 0.6" (15.24mm) Row Spacing [2]

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2-641605-2 TE Connectivity AMP Connectors Datasheet, Specs and RFQ | MPNHarbor