MC33794DWB
NXP USA Inc. · 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
IC SENSOR ELECTRIC FIELD 54-SOIC
Review exact part →other
Sensor and Detector Interfaces
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MC33794DWBR2
NXP USA Inc. · 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
IC SENSOR ELECTRIC FIELD 54-SOIC
Review exact part →MC33794EK
NXP USA Inc. · 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
IC SENSOR ELECTRIC FIELD 54SOIC
Review exact part →MC33794EKR2
NXP USA Inc. · 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
IC SENSOR ELECTRIC FIELD 54SOIC
Review exact part →MC34940EG
NXP USA Inc. · 24-SOIC (0.295", 7.50mm Width)
IC IMAGING DEVICE ELECT 24SOIC
Review exact part →MC34940EGR2
NXP USA Inc. · 24-SOIC (0.295", 7.50mm Width)
IC IMAGING DEVICE ELEC 24SOIC
Review exact part →MCP9600-E/MX
Microchip Technology · 20-VQFN Exposed Pad
IC THERMOCOUPLE TO I2C 20MQFN
Review exact part →MCP9600-I/MX
Microchip Technology · 20-VQFN Exposed Pad
IC THRMOCPLE TO DIG CONV 20MQFN
Review exact part →MCP9600T-E/MX
Microchip Technology · 20-VQFN Exposed Pad
IC THERMOCOUPLE TO I2C 20MQFN
Review exact part →MCP9600T-I/MX
Microchip Technology · 20-VQFN Exposed Pad
IC THRMOCPLE TO DIG CONV 20MQFN
Review exact part →MCP9601-E/MX
Microchip Technology · 20-VQFN Exposed Pad
IC THERMOCOUPLE
Review exact part →MCP9601T-E/MX
Microchip Technology · 20-VQFN Exposed Pad
IC THERMOCOUPLE
Review exact part →